Search results: Found 4

Listing 1 - 4 of 4
Sort by
Shape Memory Alloys 2017

Author:
ISBN: 9783038427735 9783038427742 Year: Pages: VIII, 182 DOI: 10.3390/books978-3-03842-774-2 Language: English
Publisher: MDPI - Multidisciplinary Digital Publishing Institute
Subject: Mining and Metallurgy --- Electricity
Added to DOAB on : 2018-04-06 13:33:01
License:

Loading...
Export citation

Choose an application

Abstract

Shape memory alloys (SMAs) have special property of the shape memory effect. After thermal treatment above the martensitic transition temperature, the alloys come back to the original shape when the alloys heat again after having cooled it to the temperature that is lower than the martensitic transition temperature. By means of this property, many industrial parts and systems were produced. This Special Issue "Shape Memory Alloys 2017" is constructed articles reporting new and progressive research results, as well as reviews of particular classes of fundamental physics of the materials and their applications of SMAs. Through its 17 efficient articles, the reader will approach to researches related to SMAs with their peculiar magnetic, thermo-mechanical properties, superelasticity, plastic deformation and compression under pressure. These physical properties introduce a large number of applications as faster SMA actuators, application of medical devices, industrial joining parts, volts, and magnetic/mechanical/thermal sensors. These articles are intended scientific researchers, professional engineers, students to obtain a better understanding in this field lately.

Friction Stir Welding and Processing in Alloy Manufacturing

Author:
ISBN: 9783039212071 / 9783039212088 Year: Pages: 142 DOI: 10.3390/books978-3-03921-208-8 Language: eng
Publisher: MDPI - Multidisciplinary Digital Publishing Institute
Subject: Science (General) --- Chemistry (General) --- Analytical Chemistry
Added to DOAB on : 2019-12-09 11:49:15
License:

Loading...
Export citation

Choose an application

Abstract

Friction stir welding (FSW) is considered to be the most significant development in metal joining in decades and, in addition, is a ""green"" technology due to its energy efficiency, environmental friendliness, and versatility. This process offers a number of advantages over conventional joining processes. Furthermore, because welding occurs via the deformation of material at temperatures below the melting temperature, many problems commonly associated with joining of dissimilar alloys can be avoided, and thus, high-quality welds are produced. Due to this fact, FSW has been widely used in different industrial applications where metallurgical characteristics should be retained, such as in the aeronautic, naval, and automotive industries.

Creep and High Temperature Deformation of Metals and Alloys

Authors: ---
ISBN: 9783039218783 / 9783039218790 Year: Pages: 212 DOI: 10.3390/books978-3-03921-879-0 Language: eng
Publisher: MDPI - Multidisciplinary Digital Publishing Institute
Subject: Technology (General) --- General and Civil Engineering --- Mining and Metallurgy
Added to DOAB on : 2020-01-07 09:08:26
License:

Loading...
Export citation

Choose an application

Abstract

By the late 1940s, and since then, the continuous development of dislocation theories have provided the basis for correlating the macroscopic time-dependent deformation of metals and alloys—known as creep—to the time-dependent processes taking place within the metals and alloys. High-temperature deformation and stress relaxation effects have also been explained and modeled on similar bases. The knowledge of high-temperature deformation as well as its modeling in conventional or unconventional situations is becoming clearer year by year, with new contemporary and better performing high-temperature materials being constantly produced and investigated.This book includes recent contributions covering relevant topics and materials in the field in an innovative way. In the first section, contributions are related to the general description of creep deformation, damage, and ductility, while in the second section, innovative testing techniques of creep deformation are presented. The third section deals with creep in the presence of complex loading/temperature changes and environmental effects, while the last section focuses on material microstructure–creep correlations for specific material classes. The quality and potential of specific materials and microstructures, testing conditions, and modeling as addressed by specific contributions will surely inspire scientists and technicians in their own innovative approaches and studies on creep and high-temperature deformation.

Neural Microelectrodes: Design and Applications

Authors: ---
ISBN: 9783039213191 / 9783039213207 Year: Pages: 378 DOI: 10.3390/books978-3-03921-320-7 Language: eng
Publisher: MDPI - Multidisciplinary Digital Publishing Institute
Subject: Technology (General) --- General and Civil Engineering
Added to DOAB on : 2019-12-09 11:49:15
License:

Loading...
Export citation

Choose an application

Abstract

Neural electrodes enable the recording and stimulation of bioelectrical activity in the nervous system. This technology provides neuroscientists with the means to probe the functionality of neural circuitry in both health and disease. In addition, neural electrodes can deliver therapeutic stimulation for the relief of debilitating symptoms associated with neurological disorders such as Parkinson’s disease and may serve as the basis for the restoration of sensory perception through peripheral nerve and brain regions after disease or injury. Lastly, microscale neural electrodes recording signals associated with volitional movement in paralyzed individuals can be decoded for controlling external devices and prosthetic limbs or driving the stimulation of paralyzed muscles for functional movements. In spite of the promise of neural electrodes for a range of applications, chronic performance remains a goal for long-term basic science studies, as well as clinical applications. New perspectives and opportunities from fields including tissue biomechanics, materials science, and biological mechanisms of inflammation and neurodegeneration are critical to advances in neural electrode technology. This Special Issue will address the state-of-the-art knowledge and emerging opportunities for the development and demonstration of advanced neural electrodes.

Keywords

neural interface --- silicon carbide --- robust microelectrode --- microelectrode array --- liquid crystal elastomer --- neuronal recordings --- neural interfacing --- micro-electromechanical systems (MEMS) technologies --- microelectromechanical systems --- neuroscientific research --- magnetic coupling --- freely-behaving --- microelectrodes --- in vivo electrophysiology --- neural interfaces --- enteric nervous system --- conscious recording --- electrode implantation --- intracranial electrodes --- foreign body reaction --- electrode degradation --- glial encapsulation --- electrode array --- microelectrodes --- neural recording --- silicon probe --- three-dimensional --- electroless plating --- intracortical implant --- microelectrodes --- stiffness --- immunohistochemistry --- immune response --- neural interface response --- neural interface --- micromachine --- neuroscience --- biocompatibility --- training --- education --- diversity --- bias --- BRAIN Initiative --- multi-disciplinary --- micro-electromechanical systems (MEMS) --- n/a --- silicon neural probes --- LED chip --- thermoresistance --- temperature monitoring --- optogenetics --- microfluidic device --- chronic implantation --- gene modification --- neural recording --- neural amplifier --- microelectrode array --- intracortical --- sensor interface --- windowed integration sampling --- mixed-signal feedback --- multiplexing --- amorphous silicon carbide --- neural stimulation and recording --- insertion force --- microelectrodes --- neural interfaces --- intracortical --- microelectrodes --- shape-memory-polymer --- electrophysiology --- electrode --- artifact --- electrophysiology --- electrochemistry --- fast-scan cyclic voltammetry (FSCV) --- neurotechnology --- neural interface --- neuromodulation --- neuroprosthetics --- brain-machine interfaces --- intracortical implant --- microelectrodes --- softening --- immunohistochemistry --- immune response --- neural interface --- shape memory polymer --- deep brain stimulation --- fast scan cyclic voltammetry --- dopamine --- glassy carbon electrode --- magnetic resonance imaging --- system-on-chip --- neuromodulation --- bidirectional --- closed-loop --- sciatic nerve --- vagus nerve --- precision medicine --- neural probe --- intracortical --- microelectrodes --- bio-inspired --- polymer nanocomposite --- cellulose nanocrystals --- photolithography --- Parylene C --- impedance --- Utah electrode arrays --- electrode–tissue interface --- peripheral nerves --- wireless --- implantable --- microstimulators --- neuromodulation --- peripheral nerve stimulation --- neural prostheses --- microelectrode --- neural interfaces --- dextran --- neural probe --- microfabrication --- foreign body reaction --- immunohistochemistry --- polymer --- chronic --- electrocorticography --- ECoG --- micro-electrocorticography --- µECoG --- neural electrode array --- neural interfaces --- electrophysiology --- brain–computer interface --- in vivo imaging --- tissue response --- graphene --- n/a

Listing 1 - 4 of 4
Sort by
Narrow your search

Publisher

MDPI - Multidisciplinary Digital Publishing Institute (4)


License

CC by-nc-nd (4)


Language

eng (3)

english (1)


Year
From To Submit

2019 (3)

2018 (1)

-->