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Electrical-field sensitive YBa?Cu?O??? detectors for real-time monitoring of picosecond THz pulses

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Book Series: Karlsruher Schriftenreihe zur Supraleitung / Hrsg. Prof. Dr.-Ing. M. Noe, Prof. Dr. rer. nat. M. Siegel ISSN: 18691765 ISBN: 9783731507864 Year: Volume: 21 Pages: XIV, 199 p. DOI: 10.5445/KSP/1000081476 Language: ENGLISH
Publisher: KIT Scientific Publishing
Subject: Technology (General)
Added to DOAB on : 2019-07-30 20:02:01
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This work investigates the capability of the high-temperature superconductor YBCO to sense the evolution of the electrical field of THz pulses. A deposition process for ten unit-cell thin films and a sub-µm patterning process were developed to enable high sensitivities. The detector response to THz exctiations and its electrical-field sensitivity were studied. This unique characteristic allows for the investigation of instabilities of the THz radiation emitted from synchrotron storage rings.

Slot die coating of lithium-ion battery electrodes

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ISBN: 9783731504771 Year: Pages: XIX, 171 p. DOI: 10.5445/KSP/1000051733 Language: ENGLISH
Publisher: KIT Scientific Publishing
Subject: Chemical Engineering
Added to DOAB on : 2019-07-30 20:02:02
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The Li-ion battery technology could help to accelerate the transition towards renewable energy sources. In the manufacturing chain, the electrode processing by slot die coating is one of the most crucial steps. Increased line speeds and reduced scrap rates could help decrease these costs. The scope of this work is therefore the scientific elaboration of the process limits of single and subdivided, simultaneous coated multilayer films, a minimizing of edge effects and intermittent coatings.

Influence of strain on the functionality of ink-jet printed thin films and devices on flexible substrates

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Book Series: Schriftenreihe des Instituts für Angewandte Materialien, Karlsruher Institut für Technologie ISSN: 21929963 ISBN: 9783731508533 Year: Volume: 77 Pages: X, 127 p. DOI: 10.5445/KSP/1000086125 Language: ENGLISH
Publisher: KIT Scientific Publishing
Subject: Technology (General)
Added to DOAB on : 2019-07-30 20:02:00
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Ink-jet printed devices on the flexible substrate are inexpensive and large area compatible as compared to rigid substrates. However, during fabrication and service they are subjected to complex strains, resulting in crack formation or delamination within the layers, affecting the device performance. Therefore, it is necessary to understand their failure mechanisms by correlating their electrical or structural properties with applied strain, supported by detailed microstructural investigations.

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