Search results: Found 1

Listing 1 - 1 of 1
Sort by
High Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Method

Author:
Book Series: Schriftenreihe des Instituts für Angewandte Materialien, Karlsruher Institut für Technologie ISSN: 21929963 ISBN: 9783731500254 Year: Volume: 23 Pages: XII, 140 p. DOI: 10.5445/KSP/1000034759 Language: ENGLISH
Publisher: KIT Scientific Publishing
Subject: Technology (General)
Added to DOAB on : 2019-07-30 20:02:01
License:

Loading...
Export citation

Choose an application

Abstract

In the last two decades, the reliability of small electronic devices used in automotive or consumer electronics gained researchers attention. Thus, there is the need to understand the fatigue properties and damage mechanisms of thin films. In this thesis a novel high-throughput testing method for thin films on Si substrate is presented. The specialty of this method is to test one sample at different strain amplitudes at the same time and measure an entire lifetime curve with only one experiment.

Listing 1 - 1 of 1
Sort by
Narrow your search

Publisher

KIT Scientific Publishing (1)


License

CC by-nc-nd (1)


Language

english (1)


Year
From To Submit

2013 (1)