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Semiconductor Packaging

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ISBN: 9781439862056 Year: DOI: 10.1201/b11260 Language: English
Publisher: Taylor & Francis
Subject: Agriculture (General)
Added to DOAB on : 2020-09-22 00:01:51
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In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. The book focuses on an important step in semiconductor manufacturing—package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance. The authors also discuss how the properties of packaging materials interact with each another and explore how to maximize the performance of these materials in regard to package integrity and reliability. By tying together the disparate elements essential to a semiconductor package, this easy-to-read book shows how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world.

A Journey of Embedded and Cyber-Physical Systems

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ISBN: 9783030474874 Year: Pages: 176 DOI: 10.1007/978-3-030-47487-4 Language: English
Publisher: Springer Nature
Subject: Agriculture (General)
Added to DOAB on : 2020-09-01 00:02:28
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This Open Access book celebrates Professor Peter Marwedel's outstanding achievements in compilers, embedded systems, and cyber-physical systems. The contributions in the book summarize the content of invited lectures given at the workshop “Embedded Systems” held at the Technical University Dortmund in early July 2019 in honor of Professor Marwedel's seventieth birthday. Provides a comprehensive view from leading researchers with respect to the past, present, and future of the design of embedded and cyber-physical systems; Discusses challenges and (potential) solutions from theoreticians and practitioners on modeling, design, analysis, and optimization for embedded and cyber-physical systems; Includes coverage of model verification, communication, software runtime systems, operating systems and real-time computing.

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