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Development of CMOS-MEMS/NEMS Devices

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ISBN: 9783039210688 / 9783039210695 Year: Pages: 165 DOI: 10.3390/books978-3-03921-069-5 Language: eng
Publisher: MDPI - Multidisciplinary Digital Publishing Institute
Subject: Technology (General) --- General and Civil Engineering
Added to DOAB on : 2019-06-26 08:44:07
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Abstract

Micro and nano-electro-mechanical system (M/NEMS) devices constitute key technological building blocks to enable increased additional functionalities within Integrated Circuits (ICs) in the More-Than-Moore era, as described in the International Technology Roadmap for Semiconductors. The CMOS ICs and M/NEMS dies can be combined in the same package (SiP), or integrated within a single chip (SoC). In the SoC approach the M/NEMS devices are monolithically integrated together with CMOS circuitry allowing the development of compact and low-cost CMOS-M/NEMS devices for multiple applications (physical sensors, chemical sensors, biosensors, actuators, energy actuators, filters, mechanical relays, and others). On-chip CMOS electronics integration can overcome limitations related to the extremely low-level signals in sub-micrometer and nanometer scale electromechanical transducers enabling novel breakthrough applications. This Special Issue aims to gather high quality research contributions dealing with MEMS and NEMS devices monolithically integrated with CMOS, independently of the final application and fabrication approach adopted (MEMS-first, interleaved MEMS, MEMS-last or others).]

MEMS Accelerometers

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ISBN: 9783038974147 / 9783038974154 Year: Pages: 252 DOI: 10.3390/books978-3-03897-415-4 Language: eng
Publisher: MDPI - Multidisciplinary Digital Publishing Institute
Subject: Technology (General) --- General and Civil Engineering
Added to DOAB on : 2019-06-26 08:44:06
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Micro-electro-mechanical system (MEMS) devices are widely used for inertia, pressure, and ultrasound sensing applications. Research on integrated MEMS technology has undergone extensive development driven by the requirements of a compact footprint, low cost, and increased functionality. Accelerometers are among the most widely used sensors implemented in MEMS technology. MEMS accelerometers are showing a growing presence in almost all industries ranging from automotive to medical. A traditional MEMS accelerometer employs a proof mass suspended to springs, which displaces in response to an external acceleration. A single proof mass can be used for one- or multi-axis sensing. A variety of transduction mechanisms have been used to detect the displacement. They include capacitive, piezoelectric, thermal, tunneling, and optical mechanisms. Capacitive accelerometers are widely used due to their DC measurement interface, thermal stability, reliability, and low cost. However, they are sensitive to electromagnetic field interferences and have poor performance for high-end applications (e.g., precise attitude control for the satellite). Over the past three decades, steady progress has been made in the area of optical accelerometers for high-performance and high-sensitivity applications but several challenges are still to be tackled by researchers and engineers to fully realize opto-mechanical accelerometers, such as chip-scale integration, scaling, low bandwidth, etc.

Keywords

low-temperature co-fired ceramic (LTCC) --- capacitive accelerometer --- wireless --- process optimization --- performance characterization --- MEMS accelerometer --- mismatch of parasitic capacitance --- electrostatic stiffness --- high acceleration sensor --- piezoresistive effect --- MEMS --- micro machining --- turbulent kinetic energy dissipation rate --- probe --- microelectromechanical systems (MEMS) piezoresistive sensor chip --- Taguchi method --- marine environmental monitoring --- accelerometer --- frequency --- acceleration --- heat convection --- motion analysis --- auto-encoder --- dance classification --- deep learning --- self-coaching --- wavelet packet --- classification of horse gaits --- MEMS sensors --- gait analysis --- rehabilitation assessment --- body sensor network --- MEMS accelerometer --- electromechanical delta-sigma --- built-in self-test --- in situ self-testing --- digital resonator --- accelerometer --- activity monitoring --- regularity of activity --- sleep time duration detection --- indoor positioning --- WiFi-RSSI radio map --- MEMS-IMU accelerometer --- zero-velocity update --- step detection --- stride length estimation --- field emission --- hybrid integrated --- vacuum microelectronic --- cathode tips array --- interface ASIC --- micro-electro-mechanical systems (MEMS) --- delaying mechanism --- safety and arming system --- accelerometer --- multi-axis sensing --- capacitive transduction --- inertial sensors --- three-axis accelerometer --- micromachining --- miniaturization --- stereo visual-inertial odometry --- fault tolerant --- hostile environment --- MEMS-IMU --- mode splitting --- Kerr noise --- angular-rate sensing --- whispering-gallery-mode --- optical microresonator --- three-axis acceleration sensor --- MEMS technology --- sensitivity --- L-shaped beam --- n/a

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2019 (2)