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Biaxial Characterization and Mean-field Based Damage Modeling of Sheet Molding Compound Composites

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Book Series: Schriftenreihe Kontinuumsmechanik im Maschinenbau / Karlsruher Institut für Technologie, Institut für Technische Mechanik - Bereich Kontinuumsmechanik ISSN: 2192693X ISBN: 9783731508182 Year: Volume: 13 Pages: IX, 168 p. DOI: 10.5445/KSP/1000084270 Language: ENGLISH
Publisher: KIT Scientific Publishing
Subject: Technology (General)
Added to DOAB on : 2019-07-28 18:37:01
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The focus of this work lies on the microstructure-based modeling and characterization of a discontinuous fiber-reinforced thermoset in the form of sheet molding compound (SMC). A microstructure-based parameter identification scheme for SMC with an inhomogeneous fiber orientation distribution is introduced. Different cruciform specimen designs, including two concepts to reinforce the specimens' arms are evaluated. Additionally, a micromechanical mean-field damage model for the SMC is introduced.

Innovative Technologies and Services for Smart Cities

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ISBN: 9783039211814 9783039211821 Year: Pages: 214 DOI: 10.3390/books978-3-03921-182-1 Language: English
Publisher: MDPI - Multidisciplinary Digital Publishing Institute
Subject: Technology (General) --- General and Civil Engineering --- Electrical and Nuclear Engineering
Added to DOAB on : 2019-12-09 11:49:15
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A smart city is a modern technology-driven urban area which uses sensing devices, information, and communication technology connected to the internet of things (IoTs) for the optimum and efficient utilization of infrastructures and services with the goal of improving the living conditions of citizens. Increasing populations, lower budgets, limited resources, and compatibility of the upgraded technologies are some of the few problems affecting the implementation of smart cities. Hence, there is continuous advancement regarding technologies for the implementation of smart cities. The aim of this Special Issue is to report on the design and development of integrated/smart sensors, a universal interfacing platform, along with the IoT framework, extending it to next-generation communication networks for monitoring parameters of interest with the goal of achieving smart cities. The proposed universal interfacing platform with the IoT framework will solve many challenging issues and significantly boost the growth of IoT-related applications, not just in the environmental monitoring domain but in the other key areas, such as smart home, assistive technology for the elderly care, smart city with smart waste management, smart E-metering, smart water supply, intelligent traffic control, smart grid, remote healthcare applications, etc., signifying benefits for all countries.

Microstructure and Mechanical Properties of Structural Metals and Alloys

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ISBN: 9783038975052 9783038975069 Year: Pages: 272 DOI: 10.3390/books978-3-03897-506-9 Language: English
Publisher: MDPI - Multidisciplinary Digital Publishing Institute
Subject: Technology (General) --- Chemical Engineering
Added to DOAB on : 2019-06-26 08:44:06
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The papers collected in this special issue clearly reflect the modern research trends in materials science. These fields of specific attention are high-Mn TWIP steels, high-Cr heat resistant steels, aluminum alloys, ultrafine grained materials including those developed by severe plastic deformation, and high-entropy alloys. The major portion of the collected papers is focused on the mechanisms of microstructure evolution and the mechanical properties of metallic materials subjected to various thermo-mechanical, deformation or heat treatments. Another large portion of the studies is aimed on the elaboration of alloying design of advanced steels and alloys. The changes in phase content, transformation and particle precipitation and their effect on the properties are also broadly presented in this collection, including the microstructure/property changes caused by irradiation.

Keywords

Mg–Sm–Zn–Zr --- dynamic precipitation --- microstructure --- mechanical property --- bimodal ferrite steel --- ultrafine-grained microstructure --- mechanical properties --- corrosion resistance --- abnormal grain growth --- grain boundary engineering --- electron backscattered diffraction --- growth rate --- Al metal matrix composites --- microstructure --- mechanical properties --- strengthening mechanism --- hot compression --- dynamic recovery --- dynamic recrystallization --- texture --- aluminum alloys --- Al-Fe-Si-Zr system --- microstructure --- hardness --- electrical conductivity --- metal–matrix composite --- high-pressure torsion --- microstructure evolution --- microhardness --- shape memory alloy --- columnar grain --- Cu-Al-Mn --- elastocaloric effect --- strain rate --- measuring temperature --- creep --- lead-free solder --- Sb solder --- Sn-8.0Sb-3.0Ag --- solder microstructure --- martensitic steels --- creep --- precipitation --- electron microscopy --- high-Mn TWIP steel --- cold rolling --- annealing --- recovery --- recrystallization --- strengthening --- austenitic 304 stainless steels --- sub-merged arc welding --- post-weld heat treatment --- aluminum alloys --- aging --- precipitation --- electrical resistivity --- mechanical properties --- ferritic steel --- irradiation --- nanoindentation --- hardness --- transmission electron microscopy (TEM) --- microstructure --- high-entropy alloys --- high-pressure torsion --- microstructure evolution --- twinning --- mechanical properties --- welded rotor --- weld metal --- impact toughness --- PWHT --- microstructure evolution --- Cu-Cr-Zr --- precipitation --- orientation relationship --- recrystallization --- annealing twins --- structural steel plate --- nonmetallic inclusions --- rare earth control --- M23C6 --- ion irradiation --- M6C --- amorphization --- RAFM steels --- hot stamping --- press hardening --- martensitic expansion --- force peak --- cycle time --- high-Mn steel --- deformation twinning --- dynamic recrystallization --- grain refinement --- work hardening --- in situ tensile testing --- super duplex stainless steel --- SDSS --- low-temperature --- ?-phase --- SEM --- EBSD --- microstructure analysis --- n/a

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